Integration Engineer, Yield

About Tower Semiconductor

Looking for a career path in the high tech manufacturing industry? Become part of a team focused on delivering the most exciting semiconductor technology to the world!  If you enjoy working with others in a fast pace environment and are looking for an opportunity to grow your career in the high tech industry then Tower Semiconductor is the place to be!
Tower Semiconductor is a global specialty foundry leader! We specialize in manufacturing analog integrated circuits for more than 300 customers worldwide in growing markets such as automotive, medical, industrial, consumer and aerospace and defense, among others.

Job Description

The primary functions will include the transfer and qualification of Tower’s technologies including, but not limited to advanced BCD, SiGe BICMOS, discreet power FETS and TVS devices.  The Tower fab in San Antonio is an 8” wafer fab that is fueling Tower’s growth and expansion in advanced high speed SiGe process flows developed originally at our Newport Beach facility that are being transferred to San Antonio. 

Responsible for developing, improving, and sustaining all manufacturing process flows; development of new process modules; leading and coordinating complex projects. Lead and collaborate on Technology transfers and development of new technology. Coordinate the introduction, qualification, and ramp to volume of new process flows for foundry customers. Interacts and collaborates with Process Engineering, Equipment Engineering, Operations, and R&D groups on inter-departmental and cross-functional projects.  Interact with customers on both engineering and executive levels to work technical issues and present project summaries and updates. Direct failure analysis efforts, analyze E-test and yield data and provide feedback to engineers and managers to continuously improve the manufacturing process.

This Job Is For You If

• Like to participate in inter-departmental/inter-organizational projects toward technology development and yield enhancement
• Are a leader and can drive the transfer new and novel technologies that are advancing applications in existing and emerging markets
• Help create continuous improvement projects to drive improved D0’s, reduce scrap, and improve device performance
• Lead or coordinate projects to improve process controls, minimize defects, reduce rework, study process window for new devices, qualify new products new processes for better performance and lower cost
• Analyze E-test and Yield data, disposition problem wafers and lots. Write E-test procedures, specifications, documentation, and test programs.
• Utilize advanced analytical tools and techniques and participate in teams to solve wafer fabrication problems throughout the product life-cycle
• Generate and present process capability reports for process engineering and customer reviews
• Lead or participate in intra- or inter-departmental efforts to manage excursions, containing damage, investigating and identifying root causes and implementing corrective and preventive actions
• Ability to multitask, working in a dynamic environment to react fast to changing conditions
• Able to recognize problems, device/design/test/process limitations and opportunities.
• Can work well independently as well as in team environments.
• Are able to make decisions with strong technical implications and which are based on sound data based models.

Job Requirements

• MS or PhD in Electrical or Chemical Engineering, Physics or Materials Science
• Ability to communicate and present technical concepts and analysis in an effective manner to all levels of an organization and to external customers
• Knowledge and experience in one or more of the following areas: Process Integration, Device Physics, Thin Films, Etch, CMP, Photolithography, Diffusion, CMP, Implant, E-Test
• Experience with SPC and DOE is required, 8D, FMEA, and structured problem solving is preferred.